Features:
A high-speed placement mounter for small components. As a single module of the module concept, a flexible production line can be formed according to the production capacity.
★ 13,200CPH: chip (laser recognition / actual production efficiency)
★ Laser patch head × 1 (4 nozzles)
★ 0603 (Inch 0201) chip ~ 20mm square components, or 26.5 × 11mm
★ 0402 (Inch 01005) chip is the factory option
Technical Parameters:
Substrate size M substrate (330 × 250mm)
For L substrate (410 × 360mm)
Lwide (510×360mm)
Component height 6 mm specification
12 mm size —
20 mm size —
25 mm size —
Component size 0603 chip
1005 chip ~ 20mm square component
Or 26.5×11mm
1005 chip ~ 50mm square component
Or 50 × 150mm —
Component placement speed
(actual work efficiency*1) chip component 13200CPH
IC component —
Component placement accuracy Laser recognition ±0.05mm
Image recognition —
Component mounting quantity up to 80 types
(converted to 8mm tape) (*2)
Component packaging tape (8mm, 12mm, 16mm, 24mm, 32mm, 32mm paste, 44mm, 56mm, 72mm) / rod / parts / tray
Quality about 1400kg
Power supply Three-phase AC200～415V
Apparent power 3kVA
Use air pressure 0.49±0.05Mpa
Air consumption (standard status) 230L/min
The chip mounting speed is the maximum value when 400 1608 components are mounted on the entire surface of the M-size substrate.
(CPH = average number of mounting components per hour)
Up to 110 varieties can be used with multi-layer pallet changers.
Device size (mm)
Substrate size A B C D When the transfer height is 900mm
E F G
M substrate 1300 1400 1393 — 1440 1725 2000
L substrate for 1500 1500
Lwide 1730
