Profile：Features: ★ Recognize parts and exclusive screen recognition functions with CCD camera ★ Easily mount the most advanced electronic components and maintain Sony's high-density placement technology ★ Small products that can be easily used to increase the density of electronic substrates ★8800000 point production capacity increase ★ Can be used for wafer placement machines of existing production lines ★ Compact design, power saving, space saving ★ The actual production line that effectively controls the investment cost ★ Small high-speed placement machine with outstanding performance ★ Can build a cost-effective production line ★ equipped with a rotating planetary head ★ Automatic correction of the absorbing position ★ Double sliding mechanism placement head ★ In the flight nozzle replacement